i4F Be-Lite | i4F Patents & Technologies
i4F Be-Lite® i4F Be-Lite is a patented, breakthrough technology delivering a more sustainable SPC panel production process to the global flooring industry. It cuts costs and saves CO2 at every stage of the journey, from factory to installation. A return on investment can be earned within just 2 weeks!
i4F Be-Lite enables a significant reduction (up to 20%) in the use of core SPC raw materials during the manufacturing process of decorative panels without compromising on performance. Because SPC panels produced using i4F Be-Lite are significantly lighter, it is a lot less expensive to make and transport them. This makes a significant contribution to improving the flooring industry’s carbon footprint while remaining attractive to manufacturers via costs savings.
Ultimately, that makes a meaningful difference and is truly a win: win for the industry and the planet.
i4F Be-Lite is a thermoforming technology that, depending on panels’ core thicknesses and i4F Be-Lite shape selected (honeycomb or waffle shaped), uses up to 20% less raw materials during the panel core manufacturing process. This differs to other existing material savings techniques that remove and recycle materials after the panel production process, creating more waste, costs and CO2 emissions linked to transport and the recycling of scrap.
The key component of the Be-Lite® technology is a textured roller, featuring protrusions, which are imprinted on the back of a panel on a regular SPC extrusion line. The texture does not extend to the edges of the panel, ensuring locking strength is not compromised, while reducing the total weight per sqm of products.
The resulting, lighter SPC panels maintain optimum performance, while easily reducing at least 5% of a panel’s total manufacturing raw material costs as well as decreasing transport costs by at least 6%.
The Characteristics
Manufacturers get to save on material waste and costs. They also get to reduce their carbon footprint since no extra energy is needed to produce these lighter panels which are also less expensive to transport.
Distributors and retailers get to save up at least 6% on shipping costs, as fewer containers are needed to ship the same amount of panels. They also get to reduce their carbon footprint.
Installers get to save energy and back pain. Lighter SPC panels are more comfortable to install and transport.
Consumers get to enjoy all the benefits of rigid, resilient flooring with a reduced impact on the environment.
i4F Be-Lite is a thermoforming technology that, depending on panels’ core thicknesses and i4F Be-Lite shape selected (honeycomb or waffle shaped), uses up to 20% less raw materials during the panel core manufacturing process. This differs to other existing material savings techniques that remove and recycle materials after the panel production process, creating more waste, costs and CO2 emissions linked to transport and the recycling of scrap.
The key component of the Be-Lite® technology is a textured roller, featuring protrusions, which are imprinted on the back of a panel on a regular SPC extrusion line. The texture does not extend to the edges of the panel, ensuring locking strength is not compromised, while reducing the total weight per sqm of products. The resulting, lighter SPC panels maintain optimum performance, while easily reducing at least 5% of a panel’s total manufacturing raw material costs as well as decreasing transport costs by at least 6%.
i4F Patents & Technologies | Hall 23 | Stand B15
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